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Reducing voltage drop in the path of current, it allows the plating current to flow at the maximum theoretical value of the specified voltage; low electrical and thermal conductivity to minimize electrical contact and losses; it avoids dissolving the plating solution to corrode metal; Excellent resistance to the material’s anticorrosive properties to minimize cleaning frequency and time to prevent the wear of contact surfaces.
Low temperature epoxy conductive silver adhesive is conductive adhesive with high bonding strength and electrical conductivity, which can meet various bonding needs of electronic product assembly process and the problem that welding surface is difficult to bond in the assembly and welding process of electronic products; low curing temperature, Low temperature bonding and packaging of various chips and electronic components.
High temperature sintering of the slurry can be performed on different types of thick film ceramic substrates through spraying or dipping or spraying and other methods; high temperature sintering makes it possess very low organic remaining content, highly dense conductive layer and excellent conductivity of the metallized layer formed; high coefficient matching makes it ideal to be used for the preparation of internal electrodes of precision electronic equipments such as capacitors, resistors and inductors
The advantage over other similar products is that low temperature sintering silver paste can be melted and sintering at below 250 ° C, with low organic residue left; it forms high strength metal bonding with metal surface substrate; and it has ultra high thermal, electric conductivity after sintering; applicable to IGBT and high power electronic device packaging to solve the problem of low thermal conductivity of solder.
As a conductive material that can be used to cover substrates such as PCB boards, glass, films, ceramics or metal bases by methods such as dipping, dispensing, printing, etc., conductive ink can form smooth and fine conductive coating and Conductive lines on the surface of electronic parts; low resistivity, good conductivity can be obtained; it is compatible with various types of flexible substrates..
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